Editorial Desk
Reporting
In 2025, global electric vehicle sales grew 20% year-on-year, surpassing 20 million units. China continued to lead the world with sales exceeding 13 million units, European sales grew 30%, and the U.S. market share remained stable, but policy uncertainty affected year-end sales. Emerging markets such as Nepal grew rapidly.
Advanced chip packaging is becoming the main battleground in global semiconductor competition. TSMC leads with its CoWoS technology, while Samsung and Intel are actively catching up. AI demand has sparked a global arms race across the supply chain, with governments around the world increasing investments to ensure technological autonomy.
Semiconductor manufacturing is shifting from pursuing smaller process nodes to more advanced chip packaging technology. TSMC has taken the lead with CoWoS, while Samsung and Intel are accelerating their pursuit. Countries around the world also regard advanced packaging as key to technological sovereignty, and a new race centered on AI chip packaging is now in full swing.
This article reviews the discourse by DeepMind CEO Demis Hassabis on the critical role of world models in achieving AGI, and analyzes the current research status in this field, including Google Genie, Tesla FSD, Nvidia's simulation platforms, as well as the work of Yann LeCun and others.
Morningstar releases its 2026 list of best companies, covering multiple industries including consumer, financials, healthcare, industrials, and technology. These companies possess wide economic moats and predictable cash flows, making them worthy of attention for long-term investors. However, analysts remind that even high-quality companies need to be bought at reasonable prices.
This article summarizes the core viewpoints from Automotive IQ's online autonomous driving event, exploring the important roles of expanding AI and software-defined architecture, building public trust, and forward-looking cybersecurity strategies in driving the commercialization of autonomous driving.