Stories
Tracks the technical systems, bottlenecks, and standards that reshape industrial power before they become mainstream narratives.
Advanced chip packaging is becoming the main battleground in global semiconductor competition. TSMC leads with its CoWoS technology, while Samsung and Intel are actively catching up. AI demand has sparked a global arms race across the supply chain, with governments around the world increasing investments to ensure technological autonomy.
Semiconductor manufacturing is shifting from pursuing smaller process nodes to more advanced chip packaging technology. TSMC has taken the lead with CoWoS, while Samsung and Intel are accelerating their pursuit. Countries around the world also regard advanced packaging as key to technological sovereignty, and a new race centered on AI chip packaging is now in full swing.
This week's chip industry news roundup: UC Berkeley questions the necessity of large-scale data centers; OCP launches CPO system architecture initiative; ASE and Lam Research expand production capacity; Sony and TSMC collaborate on image sensors; Nvidia's $500 billion AI infrastructure financing plan sparks heated debate; enterprise SSD share in the storage market rises; Intel secures $20 billion in financing, etc.
As demand for AI and high-performance computing surges, advanced chip packaging has become the new battleground in the semiconductor industry. TSMC leads with CoWoS technology, while Samsung and Intel are actively catching up. Governments also view packaging capability as key to technological sovereignty. This article analyzes the market landscape, key technologies, and geopolitical implications.
According to TrendForce's latest forecast, AI server shipments will grow by more than 20% in 2026, with NVIDIA facing intense competition from AMD and cloud service providers' self-developed chips. As chip power consumption exceeds 1000W, the adoption rate of liquid cooling technology is expected to reach 47%. HBM4 and optical interconnect technologies will break through bandwidth bottlenecks, providing support for trillion-parameter models. These trends will collectively shape the future of the global technology industry.
In 2025, the European semiconductor market is valued at $137.3 billion, and it is expected to reach $220.25 billion by 2034, with a compound annual growth rate of 5.4%. Electric vehicles, industrial automation, and the European Chips Act are the main growth drivers.