Stories
Tracks the technical systems, bottlenecks, and standards that reshape industrial power before they become mainstream narratives.
In 2026, enterprises will focus on closing the AI readiness gap, AI agents will accelerate in adoption and trigger governance changes, data infrastructure will evolve to become agent-ready, and companies will truly measure the return on investment of AI.
Advanced chip packaging is becoming the main battleground in global semiconductor competition. TSMC leads with its CoWoS technology, while Samsung and Intel are actively catching up. AI demand has sparked a global arms race across the supply chain, with governments around the world increasing investments to ensure technological autonomy.
Semiconductor manufacturing is shifting from pursuing smaller process nodes to more advanced chip packaging technology. TSMC has taken the lead with CoWoS, while Samsung and Intel are accelerating their pursuit. Countries around the world also regard advanced packaging as key to technological sovereignty, and a new race centered on AI chip packaging is now in full swing.
This article reviews the discourse by DeepMind CEO Demis Hassabis on the critical role of world models in achieving AGI, and analyzes the current research status in this field, including Google Genie, Tesla FSD, Nvidia's simulation platforms, as well as the work of Yann LeCun and others.
From accelerating materials discovery to optimizing supply chains, ASU is making breakthroughs in quantum computing and training the next generation of quantum scientists.
NSF awards UC San Diego a six-year, $18 million MRSEC grant to support research and development of quantum materials. The center will focus on two major research directions: quantum metamaterials and chemically tailored two-dimensional superlattices, while integrating high-performance computing and talent cultivation to advance quantum computing and low-power electronics.