Huawei proposes Tau Scaling Law: New path to chip efficiency through advanced packaging, 3D stacking, and logic layering
In late May 2026, Huawei publicly outlined its new chip concept, “Tau Scaling Law” / “Tau Law,” stressing that it no longer relies solely on further transistor shrinkage. Instead, it seeks to improve chip density, performance, and efficiency through advanced packaging, 3D stacking, and LogicFolding. Reuters and the WSJ both confirmed this direction. DIGITIMES-related coverage mentioned glass substrates in connection with the route, but the main page did not directly delve into Huawei’s chip technology. Some details, such as whether glass substrates are a core element and the exact scope of industrial impact, could not be fully verified from the provided sources.